Circuits Assembly Online Magazine - 01005: Size Does Matter
WEBFeb 2, 2015 · The smallest component currently in use is known as an 01005. This is a passive component (resistor, capacitor) possessing extremely small weight and dimensions (FIGURE 1). The device is almost invisible to the naked eye. Its dimensions are 0.4mm in length by 0.2mm in width, with a height that varies …
IFC Considers $150M Investment in Salcomp India Expansion
WEBApr 5, 2024 · Salcomp Tech would use the funds to expand its manufacturing capacity in Chennai. The total project cost is $250 million and IFC is providing a seven-year loan up to $150 million to fund the project. Salcomp Tech is 100% owned by Salcomp Plc, a Finland-based holding company. Salcomp Plc is a wholly …
Koh Young Debuts Zenith Alpha 3-D AOI - Circuits Assembly
WEBPublished: 03 October 2019. Zenith Alpha 3-D automated optical inspection (AOI) incorporates a “Smart and Dynamic” feature set, plus quality optimization technologies. Collects, analyzes and manages data in real-time to dynamically formulate a multifaced view of the assembly process. Provides reliable 3 …
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WEBMILPITAS, CA – The global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth ra... Lacroix Sees 9% Decline in H1 Electronics Revenue. SAINT HERBLAIN, FRANCE – Lacroix reported revenue of €268.1 million ($296.7 million) for the first half of the year, down 9.1% from the firs...
RiverSide Merges 3 Firms as RiverSide Integrated Solutions
WEBOwnership and employees remain unchanged, and RiverSide Integrated Solutions maintains operations at its three existing facilities in Lewiston and Winona, MN. Register now for PCB West Virtual 2020, the leading conference and exhibition for the printed circuit board industry, coming this September. pcbwest.com. Edition Here!
Mitigation of Head-in-Pillow Defect - Circuits Assembly
WEBMay 19, 2017 · Root causes of HiP are hard to identify, but often involve component warpage. Head-in-pillow (HiP), also known as head-on-pillow (HoP) or ball in socket, is a solder joint defect that occurs mainly with BGA, CSP and package-on-package (PoP) components. During reflow, both the solder paste and solder ball melt.
Summit Interconnect Acquires Advanced Assembly, Royal Circuits
WEBMay 4, 2022 · by Mike Buetow. ANAHEIM, CA – Summit Interconnect today announced the acquisition of printed circuit board fabricator Royal Circuit Solutions and its assembly affiliate Advanced Assembly for an undisclosed sum. The deal includes Royal Circuit's operations in Hollister and Santa Ana, California, and …
WEBThe compliant mechanism in the pin compresses when the pressing tool forces the contact into a PCB hole. This compliance relaxes hole size tolerance, helps. FIGURE 1: Compliant press-fit pins: C-section (top left), action pin (bot-tom left) and eye of the needle (right). FIGURE 2: PC-controlled servo-electric presses precisely control the speed ...
Neways to Construct EMS Factory in Slovakia - Circuits Assembly
WEBApr 12, 2022 · by Chelsey Drysdale. NOVA DUBNICA, SLOVAKIA – Neways said it plans to replace its two electronics manufacturing sites in Slovakia with one new 16,000 sq. m. factory, according to reports. The new site will focus on PCB, cable harnesses and cabinet production. The company says the facility will potentially grow to …
Clarifying Through-Hole Fill Levels - Circuits Assembly
WEBOct 22, 2019 · At present, through-hole joint fill requirements and inspection criteria are commonly identified and understood within the J-STD-001/IPC-A-610 specifications. Those indicate Class II/III assemblies should have at least 75% fill, based on the through-hole depth. An oblique angle view x-ray clearly shows the nature and depth of the fill ...