AMD is reportedly set to make its high-performance computing chips at TSMC’s Fab 21 in Phoenix, Arizona. Following in Apple’s ...

Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build ...

Amkor Technology Inc. and Taiwan Semiconductor Manufacturing Co. (TSMC) have signed an agreement to bring advanced packaging and test capabilities to the pure play foundry’s Arizona fabs currently ...

Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches.

Summary TSMC is partnering with Amkor Technology to provide advanced packaging and testing services in Arizona, addressing customer needs for geographic flexibility. This collaboration supports TSMC's ...

TSMC, Amkor to bring advanced chip packaging to U.S. for first time: Summary TSMC and Amkor have partnered to bring advanced chip packaging to the U.S., marking a milestone in Ame ...

TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently ...

Amkor Technology and TSMC announced the signing of a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona, further expanding the region’s semiconductor ...

Taiwan Semiconductor's robust AI-related growth supports high revenue growth and premium valuation multiples. Read why I rate ...

Apple’s chip-making partner TSMC and chip packaging company Amkor announced on Thursday that they’ve agreed in principle to ...

Amkor and TSMC on Friday said they had signed a memorandum of understanding to bring TSMC’s proven advanced packaging technologies — chip-on-wafer-on-substrate (CoWoS) and int ...

If this news sounds familiar it’s because Apple confirmed its own deal with Amkor to package Apple Silicon at TSMC last ...