Cirrus Logic (Nasdaq: CRUS), a leading provider of high-performance audio and mixed-signal semiconductor solutions, today announced the expansion of its long-standing relationship with GlobalFoundries ...

Samsung Electronics Co. will set up an advanced chip packaging research and development center in Yokohama, Japan with an investment of 25 billion yen ($170 million), according to semiconductor ...

The CST highlights the UK will require approximately 16,800 over the next five years, an increase of 4,800 new designers. Replacing retiring designers, where 39% are expected to retire in the next 15 ...

Aston University recently launched ECSTATIC, a €5.1 million ($5.9 million) European research project that repurposes fiber-optic telecom cables as real-time structural sensors.

The UCIe Consortium released the 3.0 version of its UCIe open standard, designed for high-speed, interoperable connectivity between chiplets in the same package. The new version of the standard is ...

Edge AI offers the capability to unlock better performance, scalability, security, and innovation. It’s transformative because it uses AI directly within a device, computing near the data source ...

CFrame60, the independent HW IP, for DRAM bandwidth reduction to improve performance and power efficiency, is now in Chips&Media’s roadmap for the commercialization. This decision is to expand the ...

In his Chiplet Summit keynote, Boyd Phelps, Senior Vice President and General Manager of Cadence's Silicon Solutions Group, talks about how the changeover to chiplets requires advanced tools, as well ...

Integration of Omniverse into Ansys applications offers a seamless solution for embedding, distributing, and supporting Omniverse technologies through global network of thousands of direct sellers and ...

Keysight Technologies, Inc. (NYSE: KEYS) today reported financial results for the third fiscal quarter ended July 31, 2025. "Keysight delivered strong results this quarter, exceeding the high end of ...